Full Color Blinking DIP 4.80mm Round High Brightness Light Emitting Diodes LED

Full Color Blinking High Brightness Light Emitting Diodes LED DIP 4.80mm Round

DL-F48RGBC-B1.pdf

       This is our DIP 4.80mm Round Full Color Blinking LED, Water Clear Lens  and the Emitting Color of this size is RGB full Color.

Features:

• Single lamp with 3 original colors (red, green and blue).
• Designed for bonding with LED chip.
• Triple chips embedded.
• Multiple colors compose full spectrums.
• Electricity control IC embedded.
• Lens size with 5mm / 8mm / 10mm options.
• High intensity.
• Viewing Angles: 90°.
• Fancy, fun, hottest in the market.
• Operating voltage range: 3.00~5.00V DC.
• Blinking frequency: 0.07Hz (V_DD=4.50V).
• Frequency tolerance: ± 20%.
• The product itself will remain within RoHS compliant Version.

Applications:

• The Hyper Red source color devices are made with AlGaInP on GaAs substrate Light Emitting Diode.
• The Pure Green source color devices are made with InGaN on Sapphire substrate Light Emitting Diode.
• The Blue source color devices are made with InGaN on Sapphire substrate Light Emitting Diode.

Package dimensions:

Notes:

1. All dimensions are in millimeters (inches).

2. Tolerance is ± 0.25mm (.010″) unless otherwise noted.

3. Protruded resin under flange is 1.00mm (.039″) max.

4. Specifications are subject to change without notice.

Flash Diagram of One Cycle Time:

Absolute Maximum Ratings at Ta=25℃

Electrical Optical Characteristics at Ta=25℃

Notes:

1. Luminous Intensity is measured with a light sensor and filter combination that approximates the CIE eye-response curve.

2. θ_1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.

3. The dominant wavelength (λd) is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device.

4. All specs and applications shown above subject to change without prior notice.

Typical Electrical - Optical Characteristics Curves

(25℃ Ambient Temperature Unless Otherwise Noted)

Ultra Red:

Pure Green:

Blue:

Reliability Test

Judgment criteria of failure for the reliability

Notes:

• U means the upper limit of specified characteristics. S means initial value.
• Measurement shall be taken between 2 hours and after the test pieces have been returned to normal ambient conditions after completion of each test.

Soldering:

1. Manual of Soldering

The temperature of the iron tip should not be higher than 300℃ (572℉) and Soldering within 3 seconds per solder-land is to be observed.

2. Reflow Soldering

Preheating: 140℃~160℃±5℃, within 2 minutes.

Operation heating: 235℃ (Max.) within 10 seconds (Max)

Gradual Cooling (Avoid quenching).

3. DIP soldering (Wave Soldering):

Preheating: 120℃~150℃, within 120~180 sec.

Operation heating: 245℃±5℃ within 5 sec.260℃ (Max)

Gradual Cooling (Avoid quenching).

Handling :

Care must be taken not to cause to the epoxy resin portion of LEDs while it is exposed to high temperature.

Care must be taken not rub the epoxy resin portion of LEDs with hard or sharp article such as the sand blast and the metal hook.

Notes for designing:

Care must be taken to provide the current limiting resistor in the circuit so as to drive the LEDs within the rated figures. Also, caution should be taken not to overload LEDs with instantaneous voltage at the turning ON and OFF of the circuit.

When using the pulse drive care must be taken to keep the average current within the rated figures. Also, the circuit should be designed so as be subjected to reverse voltage when turning off the LEDs.

Storage:

In order to avoid the absorption of moisture, it is recommended to solder LEDs as soon as possible after unpacking the sealed envelope.

If the envelope is still packed, to store it in the environment as following:

• Temperature : 5℃-30℃ (41℉), Humidity : RH 60﹪Max.
• After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent soldering process must be:
  • Completed within 24 hours.
  • Stored at less than 30% RH.
• Devices require baking before mounting, if (2) a or (2) b is not met.
• If baking is required, devices must be baked under below conditions: 12 hours at 60℃±3℃.

Package and Label of Products:

Products are packed in one bag of 500pcs (one taping reel) and a label is attached on each bag.