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1W & 3W High Power Purple Brightest Smd Led Chip 130 Deg Viewing Angle

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1W & 3W High Power Purple Brightest Smd Led Chip 130 Deg Viewing Angle

1W & 3W High Power Purple Brightest Smd Led Chip 130 Deg Viewing Angle
1W & 3W High Power Purple Brightest Smd Led Chip 130 Deg Viewing Angle 1W & 3W High Power Purple Brightest Smd Led Chip 130 Deg Viewing Angle

Large Image :  1W & 3W High Power Purple Brightest Smd Led Chip 130 Deg Viewing Angle

Product Details:
Place of Origin: China
Brand Name: Doule Light
Certification: RoHS/ REACH
Model Number: DL-HP10UV
Payment & Shipping Terms:
Minimum Order Quantity: 100pcs/Real
Price: US$0.3-0.4 Per piece or Price Negotiable
Payment Terms: Telegraphic Transfer in Advance (Advance TT, T/T)
Supply Ability: 2,000,000pcs per day
Detailed Product Description
Product Name: 1W & 3W High Power Purple LED Package: COB LED
Emitted Color: White Product Number: DL-HP10UV
Color Temperature: 405nm Forward Voltage: 3.5V@350mA,4.2V@700mA
Forward Current: 350mA,700mA Luminous Flux: 5-15LM/1W,15-30LM/3W
Viewing Angle: 130 Deg
High Light:

365nm uv led


uv led chip


       This is our 1W & 3W High Power Purple LED,there are two Watts when the current is different.


Part No. Chip Material Lens Color Source Color
DL-HP10UV InGaN Water Clear Purple



  • High power LED type.
  • Small package with high efficiency.
  • High flux output and high luminance.
  • Instant light (less than 100ns).
  • Very long operating life (up to100k hours).
  • Low voltage DC operated.
  • Designed for high current operation.
  • Low thermal resistance.
  • Compatible with automatic placement equipment.
  • Wide viewing angle: 130°.
  • High reliable.
  • The product itself will remain within RoHS compliant Version.




  • The HP10 series is available in soft red, orange, yellow, green, blue and white. Due to the package design, the LED has wide viewing angle and optimized light coupling by inter reflector. This feature makes the SMT LED ideal for light pipe application.
  • This package LEDs are designed for high current operation and high flux output application. But the package’s design features better thermal management characteristics than other LED solutions.




  • Counterfeit bill detection.
  • Sterilization.
  • Medical instrument.
  • Industrial use.
  • Photo catalyst excitation.
  • Phosphor excitation.
  • Sensor.
  • QA equipment.


Absolute Maximum Ratings at Ta=25℃

Parameters Symbol Rating Units
Power Dissipation PD 1400 mW

Peak Pulse Forward Current

(1/10 Duty Cycle, 0.1ms Pulse Width)

IFP 500 mA
DC Forward Current IF 350 mA
Reverse Voltage VR 5 V
Operating Temperature Range Topr -20 to +80
Storage Temperature Range Tstg -30 to +100
Soldering Temperature Tsol 260℃ for 5 Seconds (Max.)


1. It is strongly recommended that the temperature of lead be not higher than 55℃.

2. Proper current derating must be observed to maintain junction temperature below the maximum.

3. LEDs are not designed to be driven in reserve bias.



Electrical Optical Characteristics at Ta=25℃

Parameters Symbol Min. Typ. Max. Unit Test Condition
Luminous Intensity [1] IV 320 340 360 mW/Sr IF=350mA(HP60)
525 560 590 IF=700mA(HP70)
Viewing Angle [2] 1/2 --- 130 --- Deg IF=350mA/700mA
Peak Emission Wavelength[3] λp --- 395 --- nm IF=350mA/700mA
Dominant Wavelength λd --- 405 --- nm IF=350mA/700mA
Spectral Bandwidth △λ --- 15 --- nm IF=350mA/700mA
Forward Voltage VF 2.80 3.50 4.00 V IF=350mA
3.00 3.70 4.20 IF=700mA
Reverse Current IR --- --- 50 µA VR=5V


1. Luminous Intensity Measurement allowance is ± 10%.

2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.

3. The dominant wavelength (λd) is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device.



Reliability Test Items and Conditions:

The reliability of products shall be satisfied with items listed below:

Confidence level: 90%.

LTPD: 10%.

1) Test Items and Results:

No. Test Item Test Hours/Cycles Test Conditions Sample Size Ac/Re
1 Resistance to Soldering Heat 6 Min


Min. 5sec

25pcs 0/1
2 Thermal Shock 300 Cycles

H: +100℃ 5min ∫ 10 sec

L: -10℃ 5min

25pcs 0/1
3 Temperature Cycle 300 Cycles

H: +100℃ 15min ∫ 5min

L: -40℃ 15min

25pcs 0/1
4 High Temperature Storage 1000Hrs. Temp: 100℃ 25pcs 0/1
5 DC Operating Life 1000Hrs. IF=350mA 25pcs 0/1
6 Low Temperature Storage 1000Hrs. Temp: -40℃ 25pcs 0/1
7 High Temperature/ High Humidity 1000Hrs. 85℃/85%RH 25pcs 0/1


2) Criteria for Judging the Damage:

Item Symbol Test Conditions Criteria for Judgment
Min Max
Forward Voltage VF IF=350mA/IF=700mA --- F.V.*)×1.1
Reverse Current IR VR=5V --- F.V.*)×2.0
Luminous Intensity IV IF=350mA/IF=700mA F.V.*)×0.7 ---


*) F.V.: First Value.



Precautions For Use:

1. Over-current-proof

Though the high power LED has conducted ESD protection mechanism, customer must not use the device in reverse and should apply resistors for extra protection. Otherwise slight voltage shift may cause enormous current change and burn out failure would happen.

2. Storage

① Do not open moisture proof bag before the products are ready to use.

② Before opening the package, the LEDs should be kept at 30℃ or less and 90%RH or less.

③ The LEDs should be used within a year.

④ After opening the package, the LEDs should be kept at 30℃ or less and 70%RH or less.

⑤ The LEDs should be used within 168 hours (7 days) after opening the package.

⑥If the moisture absorbent material (silicone gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions.

⑦ Pre-curing treatment: 60±5℃ for 24 hours.

3. Thermal Management

① Because the LED is a high power dissipation device, special and sufficient consideration in thermal management design must be made to optimize the thermal performance.

② Heat sink design is implemented in the device for an additional thermal connection. Since the device is capable of SMT process, tin must be spread both heat sink and solder pads areas to dissipate the heat.

③ A high thermal conductivity substrate, such as Aluminum or Copper plate etc, must be applied for external thermal management. It is strongly recommended that the outer heat sink or PCB dimension per LED can not be less than 25 × 25 × 1 (L × W × H) mm. The materials for outer heat sink can be FR4 on Aluminum, MCPCB, or FPC on Aluminum.

④ Special thermal designs are also recommended to take in outer heat sink design, such as FR4 PCB on Aluminum with thermal vias or FPC on Aluminum with thermal conductive adhesive, etc.

⑤ Sufficient thermal management must be conducted, or the die junction temperature will be over the limit under large electronic driving and LED lifetime will decrease critically.

4. Soldering Condition

① Soldering should not be done more than two times.

② While soldering, do not put stress on the LEDs during heating.

③ After soldering, do not warp the circuit board.

5. Soldering Iron

① For prototype builds or small series production runs it is possible to place and solder the LED by hand.

② Dispensing thermal conductive glue or grease on the substrates and follow its curing spec. Press LED housing to closely connect LED and substrate.

③ It is recommended to hand solder the leads with a solder tip temperature of 280°C for less than 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal.

④ Be careful because the damage of the product is often started at the time of the hand solder.

6. Handling Indications

① During processing, mechanical stress on the surface should be minimized as much as possible.

② Sharp objects of all types should not be used to pierce the sealing compound.

7. Caution in ESD

Static Electricity and surge damages the LED. It is recommended to use a wrist band or anti-electrostatic glove when handling the LED. All devices equipment and machinery must be properly grounded.

Contact Details

Contact Person: Mr. Chen

Tel: 86-755-82853859

Fax: 86-755-83229774

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