Product Details:
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Chip Material: | InGaN | Source Color: | White |
---|---|---|---|
Power Dissipation Per Segment: | 100mW | Forward Current Per Segment: | 25mA |
Reverse Voltage: | 5V | Luminous Intensity: | 45mcd |
High Light: | 0.39" Dual Digit Alphanumeric Displays,100mW Dual Digit Alphanumeric Displays,45mcd Two Digit 7 Segment Display |
Device Selection Guide:
Model No. | Chip Material | Source Color | Description |
DLA2-392AWB | InGaN | White | Common Anode |
DLA2-392CWB | White | Common Cathode |
Parameters | Symbol | Max. | Unit |
Power Dissipation Per Segment | PD | 100 | mW |
Peak Forward Current Per Segment (1/10 Duty Cycle, 0.1ms Pulse Width) |
IFP | 100 | mA |
Forward Current Per Segment | IF | 25 | mA |
Dating Linear From 50℃ | 0.4 | mA/℃ | |
Reverse Voltage | VR | 5 | V |
Operating Temperature Range | Topr | -40℃ to +80℃ | |
Storage Temperature Range | Tstg | -40℃ to +85℃ | |
Soldering Temperature | Tsld | 260℃ for 5 Seconds |
Parameters | Symbol | Min. | Typ. | Max. | Unit | Test Condition |
Luminous Intensity | Iv | 25 | 45.0 | --- | mcd | IF=20mA (Note 1) |
Luminous Intensity Matching Ratio (Segment To Segment) | Iv-m | --- | --- | 2:1 | IF=10mA | |
Chromaticity Coordinates | X | --- | 0.30 | --- | nm | IF=20mA |
Y | --- | 0.31 | --- | nm | IF=20mA (Note 2) | |
Spectral Line Half-Width | △λ | --- | 25 | --- | nm | IF=20mA |
Forward Voltage | VF | --- | 3.2 | 4.0 | V | IF=20mA |
Reverse Current | IR | --- | --- | 50 | µA | VR=5V |
Notes:
1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE
eye-response curve.
2. The dominant wavelength (λd) is derived from the CIE chromaticity diagram and represents the single
wavelength which defines the color of the device.
Please read the following notes before using the datasheets:
1. Over-current-proof
Customer must apply resistors for protection, otherwise slight voltage shift will cause big current change
(Burn out will happen).
2. Storage
2.1 Do not open moisture proof bag before the products are ready to use.
2.2 Before opening the package, the LEDs should be kept at 30℃ or less and 90%RH or less.
2.3 The LEDs should be used within a year.
2.4 After opening the package, the LEDs should be kept at 30℃ or less and 70%RH or less.
3. Soldering Condition
3.1 Pb-free solder temperature profile.
3.2 Reflow soldering should not be done more than two times.
4. Soldering Iron
Each terminal is to go to the tip of soldering iron temperature less than 260℃ for 5 seconds within once in
less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each
terminal. Be careful because the damage of the product is often started at the time of the hand solder.
5. Repairing
Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a
double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics
of the LEDs will or will not be damaged by repairing.
6. Caution in ESD
Static Electricity and surge damages the LED. It is recommended to use a wrist band or anti-electrostatic
glove when handling the LED. All devices equipment and machinery must be properly grounded.
Contact Person: Mr. Chen
Tel: 86-755-82853859
Fax: 86-755-83229774