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Water Clear Subminiature Axial Ultra Yellow Brightest Chip LED 1.80mm Round

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China HongKong Double Light Electronics Technology Co. Ltd certification
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Water Clear Subminiature Axial Ultra Yellow Brightest Chip LED 1.80mm Round

Water Clear Subminiature Axial Ultra Yellow Brightest Chip LED 1.80mm Round
Water Clear Subminiature Axial Ultra Yellow Brightest Chip LED 1.80mm Round

Large Image :  Water Clear Subminiature Axial Ultra Yellow Brightest Chip LED 1.80mm Round

Product Details:
Place of Origin: China (mainland)
Brand Name: DOUBLE LIGHT
Certification: ISO9001:2008/ROHS
Model Number: DL- R18UYC- 2UY20
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: US$ 0.021-0.038per unit (Pieces)
Packaging Details: Dimensions per Unit:0.28 × 0.2 × 0.13 Meters • Weight per Unit:3.5 Kilograms • Units per Export Carton:40000 • Export Carton Dimensions L/W/H: 0.45 × 0.28 × 0.27 Meters • Export Carton Weight:14.2 Kilograms
Delivery Time: 5-7 working days after received your payment
Payment Terms: Telegraphic Transfer in Advance (Advance TT, T/T)
Supply Ability: 10,000,000pcs per Day
Detailed Product Description
Product Name: 1.8mm Chip LED Package: DIP 1.8mm Round
Emitted Color: Ultra Yellow Peak Emission Wavelength: 589nm
Chip Material: AlGaInP Lens Type: Water Clear
Forward Voltage @20ma: 1.8-2.8v Luminous Intensity: 1000-2000mcd
Viewing Angle: 20 Deg
High Light:

light emitted diode

,

light emission diode

DL-R18UYC-2UY20.pdf

Water Clear Subminiature Axial Ultra Yellow brightest led chip 1.80mm Round

 

Features:

  • 2.15×2.40mm with 1.80mm lens.
  • Small double-end package.
  • EIA Std. package.
  • Mono-color type.
  • High reliability.
  • Low forward voltage.
  • Compatible with automatic placement equipment.
  • The product itself will remain within RoHS compliant version.

Descriptions:

  • The R18 SMD taping is much smaller than leaded components. Thus enable smaller board size. Higher packing density. Reduced storage space and finally smaller equipment to be obtained.
  • Besides, light weight makes them ideal for miniature applications.
  • Furthermore by automation assembly machines the accuracy is anticipated.

Applications:

  • Small indicator for indoor applications.
  • Flat backlight for LCD, switches and symbols.
  • Indicator and backlight in office equipment.
  • Indicator and backlight for battery driven equipment.
  • Indicator and backlight for audio and video equipment.
  • Automotive: Backlighting in dashboards and switches.
  • Telecommunication: Indicator and backlighting in telephone and fax.

Package Dimension:

Water Clear Subminiature Axial Ultra Yellow Brightest Chip LED 1.80mm Round 0

 

 

Part No. Chip Material Lens Color Source Color
DL-R18UYC-2UY20 AlGaInP Water Clear Super Yellow

 

Notes:

  • All dimensions are in millimeters (inches).
  • Tolerance is ± 0.10mm (.004") unless otherwise specified.
  • Specifications are subject to change without notice.

Absolute Maximum Ratings at Ta=25℃

Parameters Symbol Max Unit
Power Dissipation PD 60 mW

Peak Forward Current

(1/10 Duty Cycle, 0.1ms Pulse Width)

IFP 100 mA
Continuous Forward Current IF 25 mA
Reverse Voltage VR 5 V
Electrostatic Discharge (HBM) ESD 2000 V
Operating Temperature Range Topr -40℃ to +80℃
Storage Temperature Range Tstg -40℃ to +85℃
Soldering Temperature Tsld 260℃ for 5 Seconds

 

Electrical Optical Characteristics at Ta=25

Parameters Symbol Min. Typ. Max. Unit Test Condition
Luminous Intensity * IV 1000 2000 --- mcd IF=20mA (Note 1)
Viewing Angle * 2θ1/2 --- 20 --- Deg IF=20mA (Note 2)
Peak Emission Wavelength λp --- 592 --- nm IF=20mA
Dominant Wavelength λd --- 589 --- nm IF=20mA (Note 3)
Spectral Line Half-Width △λ --- 15 --- nm IF=20mA
Forward Voltage VF 1.80 2.20 2.80 V IF=20mA
Reverse Current IR --- --- 10 µA VR=5V

 

Notes:

  • Luminous Intensity Measurement allowance is ± 10%.
  • θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
  • The dominant wavelength (λd) is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device.

Typical Electrical / Optical Characteristics Curves

(25℃ Ambient Temperature Unless Otherwise Noted)

Water Clear Subminiature Axial Ultra Yellow Brightest Chip LED 1.80mm Round 1

 

Reliability Test Items And Conditions:

The reliability of products shall be satisfied with items listed below:

Confidence level: 90%.

LTPD: 10%.

1) Test Items and Results:

No. Test Item Test Hours/Cycles Test Conditions Sample Size Ac/Re
1 Resistance to Soldering Heat 6 Min

Tsld=260±5℃,

Min. 5sec

25pcs 0/1
2 Thermal Shock 300 Cycles

H: +100℃ 5min ∫ 10 sec

L: -10℃ 5min

25pcs 0/1
3 Temperature Cycle 300 Cycles

H: +100℃ 15min ∫ 5min

L: -40℃ 15min

25pcs 0/1
4 High Temperature Storage 1000Hrs. Temp: 100℃ 25pcs 0/1
5 DC Operating Life 1000Hrs. IF=20mA 25pcs 0/1
6 Low Temperature Storage 1000Hrs. Temp: -40℃ 25pcs 0/1
7 High Temperature/ High Humidity 1000Hrs. 85℃/85%RH 25pcs 0/1

 

2) Criteria for Judging the Damage:

Item Symbol Test Conditions Criteria for Judgment
Min Max
Forward Voltage VF IF=20mA --- F.V.*)×1.1
Reverse Current IR VR=5V --- F.V.*)×2.0
Luminous Intensity IV IF=20mA F.V.*)×0.7 ---

 

*) F.V.: First Value.

 

Please read the following notes before using the product:

1. Over-current-proof

Customer must apply resistors for protection, otherwise slight voltage shift will cause big current change (Burn out will happen).

2. Storage

2.1 Do not open moisture proof bag before the products are ready to use.

2.2 Before opening the package, the LEDs should be kept at 30℃ or less and 90%RH or less.

2.3 The LEDs should be used within a year.

2.4 After opening the package, the LEDs should be kept at 30℃ or less and 70%RH or less.

2.5 The LEDs should be used within 168 hours (7 days) after opening the package.

2.6 If the moisture adsorbent material (silica gel) has fabled away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment: 60±5℃ for 24 hours.

3. Soldering Condition

3.1 Pb-free solder temperature profile.

Water Clear Subminiature Axial Ultra Yellow Brightest Chip LED 1.80mm Round 2

3.2 Reflow soldering should not be done more than two times.

3.3 When soldering, do not put stress on the LEDs during heating.

3.4 After soldering, do not warp the circuit board.

4. Soldering Iron

Each terminal is to go to the tip of soldering iron temperature less than 260℃ for 5 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder.

5. Repairing

Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.

 

Water Clear Subminiature Axial Ultra Yellow Brightest Chip LED 1.80mm Round 3

6. Caution in ESD

Static Electricity and surge damages the LED. It is recommended to use a wrist band or anti-electrostatic glove when handling the LED. All devices, equipment and machinery must be properly grounded.

 

 

Contact Details
HongKong Double Light Electronics Technology Co. Ltd

Contact Person: Mr. Rony Qiu

Tel: +8613510796631

Send your inquiry directly to us (0 / 3000)