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DL-PCB3535RGBC SMD Chip LED , 3W High Power 3535 RGB Full Color LED, Red, Green,Blue tri-color

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DL-PCB3535RGBC SMD Chip LED , 3W High Power 3535 RGB Full Color LED, Red, Green,Blue tri-color

DL-PCB3535RGBC SMD Chip LED , 3W High Power 3535 RGB Full Color LED, Red, Green,Blue tri-color
DL-PCB3535RGBC SMD Chip LED , 3W High Power 3535 RGB Full Color LED, Red, Green,Blue tri-color DL-PCB3535RGBC SMD Chip LED , 3W High Power 3535 RGB Full Color LED, Red, Green,Blue tri-color

Large Image :  DL-PCB3535RGBC SMD Chip LED , 3W High Power 3535 RGB Full Color LED, Red, Green,Blue tri-color

Product Details:

Place of Origin: China
Brand Name: Doule Light
Certification: RoHS/ REACH
Model Number: DL-PCB3535RGBC

Payment & Shipping Terms:

Minimum Order Quantity: 1000pcs/Reel
Price: US$0.30-0.50 Per piece or Price Negotiable
Delivery Time: 10-12 woriking days after payment received
Payment Terms: Telegraphic Transfer in Advance (Advance TT, T/T)
Supply Ability: 2,000,000pcs per day
Detailed Product Description
Product Name: 3W High Power 3535 RGB Full Color LED Package: High Power LED With Lens
Emitted Color: RGB Full Color Product Number: DL-PCB3535RGBC
Dominant Wavelength: Red:620-630nm, Pure Green:525-530nm, Blue:460-470nm Forward Voltage: Red:2.0-3.0V, Pure Green:2.8-4.0V, Blue:2.8-4.0V
Forward Current: 350mA For Three Colors Luminous Flux: Red:40-50Lm, Pure Green:60-80LM, Blue:15-25LM
Viewing Angle: 120Deg Datasheet: Update
High Light:

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Datasheet: DL-PCB3535RGBC.pdf                Light source: RGB
 

      3W High Power 3535 Full Color LED

 

This is our 3W High Power 3535 RGB Full Color LED.

 

Features:

  • Very long operating life (up to100k hours).
  • Three chips (color) in one package.
  • Independent control of each color.
  • More energy efficient than incandescent and most halogen lamps.
  • Low voltage operated.
  • Instant light.
  • Long operating life.
  • IR reflow process compatible.
  • The product itself will remain within RoHS compliant Version.

 

Descriptions:

  • DL-PCB3535RGBC is one of the highest flux LEDs in the world. It is designed to satisfy applications of Solid-State lighting. It is designed to have three chips in one package. It has various colors for choice and can be independently controlled. More important, it can be pass reflow process.

 

Applications:

Up-lighters and Down-lighters.

  • Contour lights.
  • Ceiling lights.
  • Garden lighting.
  • Architectural lighting.
  • Beacon lights.

 

Mechanical Dimensions:

DL-PCB3535RGBC SMD Chip LED , 3W High Power 3535 RGB Full Color LED, Red, Green,Blue tri-color 0

 

Part No. Chip Material Source Color
DL-PCB3535RGBC R AlGaInP Ultra Red
G InGaN Pure Green
B InGaN Blue

 

Notes:

  • All dimensions are in millimeters.
  • Tolerance is ± 0.25 mm (.010″) unless otherwise noted.

 

Absolute Maximum Ratings at Ta=25℃

Parameters Symbol Rating Units
Forward Current IF 350 mA

Peak Pulse Current

(tp≤100μs, Duty cycle=0.25)

I pulse 1000 mA
Reverse Voltage VR 5 V
LED Junction Temperature Tj 135
Operating Temperature Range Topr -40 to +80
Storage Temperature Range Tstg -40 to +100
Soldering Time at 260 ℃ (Max.) Tsol 5 Seconds

 

Notes:

1. Proper current derating must be observed to maintain junction temperature below the maximum.

2. LEDs are not designed to be driven in reserve bias.

 

Electrical Optical Characteristics at Ta=25℃

Parameters Symbol Emitting Color Min. Typ. Max. Unit Test Condition
Viewing Angle 1/2 Full color --- 120 --- Deg IF=350mA
Forward Voltage VF Red 2.0 2.2 3.0 V IF=350mA
Green 2.8 3.2 4.0
Blue 2.8 3.5 4.0
Peak Emission Wavelength λp Red --- 625 --- nm

Measurement

@Peak

Green --- 520 ---
Blue --- 465 ---
Dominant Wavelength λd Red 620 626 630 nm  
Green 525 528 530
Blue 460 464 470
Spectral Line Half-Width λ Red --- 18 --- nm IF=350mA
Green --- 36 ---
Blue --- 20 ---
Luminous Flux Фv Red 40 45 --- lm IF=350mA
Green 60 70 ---
Blue 15 20 ---

Notes:

1. Luminous Flux Measurement allowance is ± 10%.

2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.

 

 

Typical Electrical-Optical Characteristics Curves

(25℃ Ambient Temperature Unless Otherwise Noted)

DL-PCB3535RGBC SMD Chip LED , 3W High Power 3535 RGB Full Color LED, Red, Green,Blue tri-color 1

DL-PCB3535RGBC SMD Chip LED , 3W High Power 3535 RGB Full Color LED, Red, Green,Blue tri-color 2DL-PCB3535RGBC SMD Chip LED , 3W High Power 3535 RGB Full Color LED, Red, Green,Blue tri-color 3

 

 

DL-PCB3535RGBC SMD Chip LED , 3W High Power 3535 RGB Full Color LED, Red, Green,Blue tri-color 4

 

Typical Electrical / Optical Characteristics Curves

DL-PCB3535RGBC SMD Chip LED , 3W High Power 3535 RGB Full Color LED, Red, Green,Blue tri-color 5

 

DL-PCB3535RGBC SMD Chip LED , 3W High Power 3535 RGB Full Color LED, Red, Green,Blue tri-color 6

DL-PCB3535RGBC SMD Chip LED , 3W High Power 3535 RGB Full Color LED, Red, Green,Blue tri-color 7

 

Precautions For Use:

1. Over-current-proof

Though HP60M has conducted ESD protection mechanism, customer must not use the device in reverse and should apply resistors for extra protection. Otherwise slight voltage shift may cause enormou current change and burn out failure would happen.

2. Storage

① Do not open moisture proof bag before the products are ready to use.

② Before opening the package, the LEDs should be kept at 30℃ or less and 90%RH or less.

③ The LEDs should be used within a year.

④ After opening the package, the LEDs should be kept at 30℃ or less and 70%RH or less.

⑤ The LEDs should be used within 168 hours (7 days) after opening the package.

⑥ If the moisture absorbent material (silicone gel) has faded away or the LEDs have exceeded the storag time, baking treatment should be performed using the following conditions.

⑦ Pre-curing treatment: 60±5℃ for 24 hours.

3. Thermal Management

① Because HP60M LED is a high power dissipation device, special and sufficient consideration in thermal management design must be made to optimize the thermal performance.

② Heat sink design is implemented in the device for an additional thermal connection. Since the device is capable of SMT process, tin must be spread both heat sink and solder pads areas to dissipate the heat.

③ A high thermal conductivity substrate, such as Aluminum or Copper plate etc, must be applied for external thermal management. It is strongly recommended that the outer heat sink or PCB dimension per LED can not be less than 25 x 25 x 1 (L x W x H) mm. The materials for outer heat sink can be FR4 on Aluminum, MCPCB, or FPC on Aluminum.

④ Special thermal designs are also recommended to take in outer heat sink design, such as FR4 PCB on Aluminum with thermal vias or FPC on Aluminum with thermal conductive adhesive, etc.

⑤ Sufficient thermal management must be conducted, or the die junction temperature will be over the limit under large electronic driving and LED lifetime will decrease critically.

4. Soldering Condition

① Soldering should not be done more than two times.

② While soldering, do not put stress on the LEDs during heating.

③ After soldering, do not warp the circuit board.

 

5. Soldering Iron

① For prototype builds or small series production runs it is possible to place and solder the LED by hand.

② Dispensing thermal conductive glue or grease on the substrates and follow its curing spec. Press LED housing to closely connect LED and substrate.

③ It is recommended to hand solder the leads with a solder tip temperature of 280°C for less than 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal.

④ Be careful because the damage of the product is often started at the time of the hand solder.

6. Handling Indications

During processing, mechanical stress on the surface should be minimized as much as possible.

Sharp objects of all types should not be used to pierce the sealing compound.

 

For more details, please contact us.

Email:Facebook @doublelight.com.cn

DL-PCB3535RGBC SMD Chip LED , 3W High Power 3535 RGB Full Color LED, Red, Green,Blue tri-color 8

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Contact Person: Mr. Rony Qiu

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