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1W 3W High Power 3535 White SMD LED , Brightest Led Chip 2.8-3.8 Voltage

1W 3W High Power 3535 White SMD LED , Brightest Led Chip 2.8-3.8 Voltage

    • 1W 3W High Power 3535 White SMD LED , Brightest Led Chip 2.8-3.8 Voltage
    • 1W 3W High Power 3535 White SMD LED , Brightest Led Chip 2.8-3.8 Voltage
  • 1W 3W High Power 3535 White SMD LED , Brightest Led Chip 2.8-3.8 Voltage

    Product Details:

    Place of Origin: China
    Brand Name: Doule Light
    Certification: RoHS/ REACH
    Model Number: DL-PCB3535W

    Payment & Shipping Terms:

    Minimum Order Quantity: 100pcs/Real
    Price: US$0.13-0.3 Per piece or Price Negotiable
    Payment Terms: Telegraphic Transfer in Advance (Advance TT, T/T)
    Supply Ability: 2,000,000pcs per day
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    Detailed Product Description
    Product Name: 1W&3W High Power 3535 White LED Package: High Power LED
    Emitted Color: White Product Number: DL-PCB3535W
    Color Temperature: 2600-7000K Forward Voltage: 2.8-3.8V
    Forward Current: 350mA/700mA Luminous Flux: 120-130lm/ 220-240lm
    Viewing Angle: 90 Deg

    Datasheet:DL-PCB3535W.pdf              light source: White

          

    DL-PCB3535W

     

    This is our 1W&3W High Power 3535 White LED,its color is available in white, green, blue, red, yellow, Amber according to your need.

     

     

    Part No. Chip Material Lens Color Source Color
    DL-PCB3535W InGaN White Diffused White

     

    Notes:

    • The marked is cathode.
    • All dimensions are in millimeters.
    • Tolerance is ± 0.25 mm (.010″) unless otherwise noted.

    Specifications are subject to change without notice.

     

    Features:

    • Small package with high efficiency
    • Long operating life.
    • Available in white, green, blue, red, yellow, Amber
    • Typical color temperature: 5500-6500 K.
    • View angle: 120°.
    • Low voltage DC operated.
    • The product itself will remain within RoHS compliant Version.
    • ESD protection.

     

    Applications:

    • Reading lights (car, bus, aircraft).
    • Portable (flashlight, bicycle).
    • Mini_accent/Uplighters/Downlighters/Orientation.
    • Bollards/Security/Garden.
    • Cove/Undershelf/Task.
    • Automotive rear combination lamps.
    • Traffic signaling/Beacons/ Rail crossing and Wayside.
    • Indoor/Outdoor Commercial and Residential Architectural.
    • Edge_lit signs (Exit, point of sale).
    • LCD Backlights/Light Guides.

     

     

    Absolute Maximum Ratings at Ta=25

     

    Parameters Symbol Max. Unit
    Power Dissipation PD 3000 mW

    Peak Forward Current

    (1/10 Duty Cycle, 0.1ms Pulse Width)

    IFP 1000 mA
    Forward Current IF 350/700 mA
    Reverse Voltage VR 5 V
    Electrostatic Discharge (HBM) ESD 4000 V
    Operating Temperature Range Topr -10℃ to +70℃
    Storage Temperature Range Tstg -20℃ to +80℃
    Soldering Temperature Tsld 260℃ for 5 Seconds

     

     

    Electrical Optical Characteristics at Ta=25

     

    Parameter Symbol Min. Typ. Max. Unit Test Condition
    Luminous Flux Φ 100 120 130 lm If=350mA (Note 1)
    200 220 240 lm If=700mA (Note 1)
    Viewing Angle 2θ(1/2) --- 90 --- Deg (Note 2)
    Color Temperature TC 5500 --- 6500 K If=350/700mA
    Forward Voltage VF 2.80 3.40 3.80 V If=350/700mA
    Reverse Current IR --- --- 10 µA VR=5V

     

    Notes:

    1. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.

     

     

    Reliability Test Items And Conditions:

    The reliability of products shall be satisfied with items listed below:

    Confidence level: 90%.

    LTPD: 10%.

    No. Item Test Conditions

    Test Hours/

    Cycles

    Sample

    Sizes

    Failure

    Judgment

    Criteria

    Ac/

    Re

    1 Reflow Soldering

    TEMP.: 260℃+5℃

    5secs

    6mins 22pcs

     

     

    IR≧U*2

    Ee≦L*0.8

    VF≧U*1.2

     

     

    U: Upper

    Specification

    Limit

    L: Lower

    Specification

    Limit

     

     

    0/1
    2 Temperature Cycle

    H: +100℃ 15mins

    5 mins

    L: -40℃ 15mins

    50Cycles 22pcs 0/1
    3 Thermal Shock

    H: +100℃ 15mins

    10mins

    L: -10℃ 5mins

    50Cycles 22pcs 0/1
    4

    High Temperature

    Storage

    TEMP.: +100℃ 1000hrs 22pcs 0/1
    5

    Lower Temperature

    Storage

    TEMP.: -40℃ 1000hrs 22pcs 0/1
    6 DC Operating Life VCE=5V 1000hrs 22pcs 0/1
    7

    High Temperature/

    High Humidity

    85℃ / 85% R.H. 1000hrs 22pcs 0/1

     

     

     

    Precautions for Use:

    • Over-current-proof

    Customer must apply resistors for protection, otherwise slight voltage shift may cause enormous current change and burn out failure would happen.

    • Storage
      • Do not open moisture proof bag before the products are ready to use.
      • Before opening the package, the Infrareds should be kept at 30℃ or less and 90%RH or less.
      • The Infrared LED should be used within a year.
      • After opening the package, the Infrareds should be kept at 30℃ or less and 70%RH or less.
      • The Infrared LED should be used within 168 hours (7 days) after opening the package.
      • If the moisture absorbent material (silicone gel) has faded away or the Infrareds have exceeded the storage time, baking treatment should be performed using the following conditions.
      • Pre-curing treatment: 60±5℃ for 24 hours.
    • Thermal Management
    • Because the Infrared LED is a high power dissipation device, special and sufficient consideration in thermal management design must be made to optimize the thermal performance.
    • Heat sink design is implemented in the device for an additional thermal connection. Since the device is capable of SMT process, tin must be spread both heat sink and solder pads areas to dissipate the heat.
    • A high thermal conductivity substrate, such as Aluminum or Copper plate etc, must be applied for external thermal management. It is strongly recommended that the outer heat sink or PCB dimension per Infrared LED can not be less than 25 x 25 x 1 (L x W x H) mm. The materials for outer heat sink can be FR4 on Aluminum, MCPCB, or FPC on Aluminum.
    • Special thermal designs are also recommended to take in outer heat sink design, such as FR4 PCB on Aluminum with thermal vias or FPC on Aluminum with thermal conductive adhesive, etc.
    • Sufficient thermal management must be conducted, or the die junction temperature will be over the limit under large electronic driving and Infrared LED lifetime will decrease critically.
    • Soldering Condition
    • Reflow soldering should not be done more than two times.
    • While soldering, do not put stress on the Infrareds during heating.
    • After soldering, do not warp the circuit board.
    • Soldering Iron
    • For prototype builds or small series production runs it is possible to place and solder the LED by hand.
    • Dispensing thermal conductive glue or grease on the substrates and follow its curing spec. Press Infrared housing to closely connect Infrared and substrate.
    • It is recommended to hand solder the leads with a solder tip temperature of 280°C for less than 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal.
    • Be careful because the damage of the product is often started at the time of the hand solder.

     

    • Handling Indications
    • During processing, mechanical stress on the surface should be minimized as much as possible.
    • Sharp objects of all types should not be used to pierce the sealing compound.

     

    For other parameters and pictures, please see the attachment PDF files,thank you.

     

    For more details, please contact us.
    Email:Facebook@doublelight.com.cn

    1W 3W High Power 3535 White SMD LED , Brightest Led Chip 2.8-3.8 Voltage

     

    Contact Details
    HongKong Double Light Electronics Technology Co. Ltd

    Contact Person: Tanky

    Tel: +8613750005407

    Send your inquiry directly to us (0 / 3000)

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