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SMD Size 4.8x3.6mm LED Light Components Round Subminiature Package high power infrared led Chip

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SMD Size 4.8x3.6mm LED Light Components Round Subminiature Package high power infrared led Chip

SMD Size 4.8x3.6mm LED Light Components Round Subminiature Package high power infrared led Chip
SMD Size 4.8x3.6mm LED Light Components Round Subminiature Package high power infrared led Chip SMD Size 4.8x3.6mm LED Light Components Round Subminiature Package high power infrared led Chip

Large Image :  SMD Size 4.8x3.6mm LED Light Components Round Subminiature Package high power infrared led Chip

Product Details:
Place of Origin: China
Brand Name: Double Light
Certification: ISO9001:2008,Rosh
Model Number: DL-PCB4836SIRC-2SIR60
Payment & Shipping Terms:
Minimum Order Quantity: 1000 PCS
Price: USD 0.1-0.13/PCS
Packaging Details: Dimensions per Unit:0.28 × 0.2 × 0.13 Meters • Weight per Unit:3.5 Kilograms • Units per Export Carton:40000 • Export Carton Dimensions L/W/H: 0.45 × 0.28 × 0.27 Meters • Export Carton Weight:14.2 Kilograms
Delivery Time: 5-7 working days after received your payment
Payment Terms: Telegraphic Transfer in Advance (Advance TT, T/T)
Supply Ability: 15,000,000pcs per Day
Detailed Product Description
Product Name: Infrared LED Light Components Power (mW): 200
Emitted Color: Infrared LED Chip Material: GaAlAs
Peak Emission Wavelength: 850nm Forward Voltage @20ma: 1.0-1.4V
Viewing Angle: 60 Deg Radiant Intensity: 15mW/sr
High Light:

led light components parts

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led light chip

SMD Size 4.8x3.6mm LED Light Components Round Subminiature Package high power infrared led Chip

Infrared LED Light Components

 

 Features:

  1. Package in 12mm tape on 7" diameter reels.
  2. Compatible with automatic placement equipment.
  3. Compatible with infrared and vapor phase reflow solder process.
  4. High reliability.
  5. Low forward voltage.
  6. Mono-color type.
  7. The product itself will remain within RoHS compliant version.

 

Descriptions:

 

  1. The device is an infrared emitting diode in miniature 4836SMD package which is molded in water clear plastic.
  2. The device is much smaller than leaded components. Thus enable smaller board size. Higher packing density. Reduced storage space and finally smaller equipment to be obtained.
  3. The device is specially matched with photodiode, phototransistor and infrared receiver module.

 

Applications:

 

  1. PCB mounted infrared sensor.
  2. Infrared emitting for miniature light barrier.
  3. Floppy disk drive.
  4. Optoelectronic switch.
  5. Smoke detector.

 

Part No. Chip Material Lens Color Source Color
DL-PCB4836SIRC-2SIR60 GaAlAs White Diffused Infrared

 

 

 

 

 

 

 

Absolute Maximum Ratings at Ta=25℃

Parameters Symbol Max. Unit
Power Dissipation PD 200 mW

Peak Forward Current

(1/10 Duty Cycle, 0.1ms Pulse Width)

IFP 1.0 A
Continuous Forward Current IF 150 mA
Reverse Voltage VR 5 V
Operating Temperature Range Topr -40℃ to +80℃
Storage Temperature Range Tstg -40℃ to +85℃
Soldering Temperature Tsld 260℃ for 5 Seconds
 

 

Electrical Optical Characteristics at Ta=25℃

Parameters Symbol Min. Typ. Max. Unit Test Condition
Radiant Intensity (Note 1) * Ee 8 15 --- mW/sr IF=100mA
Viewing Angle (Note 2) * 2θ1/2 --- 60 --- Deg IF=100mA
Peak Emission Wavelength λp --- 850 --- nm IF=100mA
Spectral Bandwidth △λ --- 45 --- nm IF=100mA
Forward Voltage VF 1.40 1.45 1.85 V IF=100mA
Reverse Current IR --- --- 10 µA VR=5V
 

Notes:

  1. Luminous Radiant is measured with a light sensor and filter combination that approximates the CIE eye-response curve.
  2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.

 

 

 

Infrared LED Light Components Package Dimension:

SMD Size 4.8x3.6mm LED Light Components Round Subminiature Package high power infrared led Chip 0

 

 

Contact Details
HongKong Double Light Electronics Technology Co. Ltd

Contact Person: Mr. Rony Qiu

Tel: +8613510796631

Send your inquiry directly to us (0 / 3000)